AMD / Xilinx Kria K26 System-on-Modules

AMD / Xilinx Kria K26 System-on-Modules integrate a custom-built Zynq® UltraScale+™ MPSoC that runs optimally (and exclusively) on the K26 SOM. The devices feature DDR memory, nonvolatile storage devices, a security module, and an aluminum thermal heat spreader. The SOM is designed to be plugged into a carrier card with solution-specific peripherals. Key target applications include smart city, machine vision, industrial robotics, and AI/ML computing.

Features

Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade)
4GB 64-bit wide DDR4 memory
TPM2.0 security module
Two 240-pin connectors with access to user-configurable I/O:
- PS MIO
- PS-GTR transceivers
- PS I²C platform control bus
- PL HPIO
- PL HDIO
- PL GTH transceivers
- Sideband platform signals
- Power and power sequencing signals

Integrated non-volatile memory devices
- 512Mb QSPI
- 16GB eMMC
- 64Kb EEPROM
Integrated and flexible power design
- SOC power supplies derived from a single +5V input
- PL I/O supplies customized through carrier card-defined power rails
Compact mechanical size with integrated thermal heat spreader

AMD / Xilinx Kria K26 System-on-Modules

Features

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Block Diagram

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