Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards

Infineon Technologies REF_SiC_D2Pak_MC and REF_SiC_D2Pak_BP Reference Boards allow users to evaluate the 1200V CoolSiC™ MOSFET in D2Pak with coreless isolated gate drivers. The REF_SiC_D2Pak_MC Board utilizes the 1EDC20I12MH with Miller clamp function. The REF_SiC_D2Pak_BP Board utilizes the 1EDI20H12AH with bipolar power supply and separated sink/source output.

The Infineon REF_SiC_D2Pak_MC and REF_SiC_D2Pak_BP Reference Boards are designed as daughter boards to fit the 1200V CoolSiC MOSFET in the TO-247 3-/4-pin evaluation platform. Users can do a double pulse test to evaluate the CoolSiC MOSFET’s performance and coreless isolated gate drivers by installing the reference daughterboard on the evaluation platform.

Features

Both daughter boards utilize insulated metal substrate (IMS), which provides an excellent thermal conduction capability
All the components are surface mounted devices (SMD) due to the IMS board type
Creepage is at least 4mm to ensure the safe operation under 800VDC bus voltage

Block diagram

Component Layout

Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards

Infineon Power and Sensing Selection Guide

Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards

Features

Block diagram

Component Layout

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