Infineon Technologies S80KS2562 & S80KS2563 256Mb HYPERRAM™ 2.0 Memory

Infineon Technologies S80KS2562 and S80KS2563 HYPERRAM™ 2.0 Memory are high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) with a HyperBUS (S80KS2562) or Octal xSPI (S80KS2563) interface. Both devices feature a 200MHz maximum clock rate, a data throughput of up to 400MBps, and energy-saving Hybrid Sleep and Deep Power-Down modes. The S80KS2562 and S80KS2563 HYPERRAM are ideal for use in high-performance embedded systems requiring expansion memory for scratchpad or buffering purposes.

The HyperBus and Octal xSPI interfaces supported by HYPERRAM products draw upon the legacy features of parallel and serial interface memories while enhancing system performance and ease of design and reducing system cost.

The low-pin count architecture makes HYPERRAM especially suitable for power and board space-constrained applications requiring off-chip external RAM.

Infineon Technologies S80KS2562 and S80KS2563 256Mb HYPERRAM Memory are available in a 24-ball Fine-Pitch Ball Grid Array (FBGA) package.

Features

  • Technology: 25nm DRAM
  • Interface
    • S80KS2562: HyperBUS™ Interface
    • S80KS2563: xSPI (Octal) interface
    • 1.8V interface support
      • Single-ended clock (CK) with 11 bus signals
      • Optional differential clock (CK, CK#) with 12 bus signals
    • Chip select (CS#)
    • 8-bit data bus (DQ[7:0])
    • Hardware reset (RESET#)
    • Bidirectional read-write data strobe (RWDS)
      • Output at the start of all transactions to indicate refresh latency
      • Output during read transactions as read data strobe
      • Input during write transactions as write data mask
  • Array refresh
    • Partial memory array
    • Full
  • Power
    • 22mA/25mA burst read/write current consumption
    • Hybrid Sleep mode
    • Deep Power Down Mode
  • Performance
    • 200MHz maximum clock rate
    • 35ns maximum access time
    • DDR – transfers data on both edges of the clock
    • Data throughput up to 400MBps (3200Mbps)
    • Configurable burst characteristics
      • Linear burst
      • Wrapped burst lengths
        • 16 bytes (8 clocks)
        • 32 bytes (16 clocks)
        • 64 bytes (32 clocks)
        • 128 bytes (64 clocks)
      • Hybrid option – one wrapped burst followed by a linear burst
    • Configurable output drive strength
  • Package
    •  6.0mm x 8.0mm FBGA-24 package, 1.0mm pitch

Applications

  • Automotive instrument clusters, infotainment, and telematics systems
  • Industrial and consumer HMI display panels
  • Industrial machine vision
  • Consumer wearable devices
  • Communication modules

Resources

  • S80KS2562 Datasheet
  • S80KS2563 Datasheet
  • HyperRAM Product Brief
  • Getting Started with HyperRAM

Videos

Logic Block Diagram

Block Diagram - Infineon Technologies S80KS2562 & S80KS2563 256Mb HYPERRAM™ 2.0 Memory

Infineon Technologies S80KS2562 & S80KS2563 256Mb HYPERRAM™ 2.0 Memory