Infineon Technologies Flash+RAM MCP Solutions are for systems that require flash and RAM, implementing Infineon’s multi-chip package (MCP) solutions to simplify overall system design. MCP products integrate both memories into a single package, decreasing the BOM, lowering the pin count, and reducing PCB size and layer requirements. The Flash+RAM MCP Solutions supply performance and quality into one space-saving package.
The Infineon Flash+RAM MCP Solutions Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. The MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR Flash and from HYPERRAM™ 1.0 to HYPERRAM™ 2.0. MCP Gen 2 also extends chipset support by adding an Octal interface option.