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Texas Instruments SURFACE-MOUNT-ADAPTER-EVM Evaluation Modules (EVMs) allows engineers to test the current, smaller comparator and amplifier packages without needing to spin the user’s existing circuit board. These evaluation modules convert the most popular small packages into familiar, larger footprints like SOIC, VSSOP, and TSSOP in 8-pin, 14-pin, and 16-pin footprints. This option enables engineers to save effort and time by helping verify that a device will achieve design goals before needing to adjust the printed circuit board (PCB) layout. Once the design evaluation is complete, engineers can use these evaluation modules as a reference to implement a dual-footprint layout that accepts both the smaller and larger package. Alternatively, the user can reduce the PCB size by optimizing the layout for the smaller package. The Texas Instruments SURFACE-MOUNT-ADAPTER-EVM is available in four different options.
D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF)
QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG)
SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5×3-5/6 (DRL) and WSON-6 (DSE)
TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5×3-5/6 (DRL) and WSON-6 (DSE)
