TDK InvenSense T583x Microphone Flexible Evaluation Boards

TDK InvenSense T583x Microphone Flexible Evaluation Boards allow quick evaluation of T583x PDM Bottom Port MEMS Microphone performance. The small size and low profile of the flexible PCBs enable direct placement of the microphone into a prototype or an existing design for an in situ evaluation. The evaluation board consists of a bottom port microphone soldered to a flexible PCB with an edge connector. Other components on the board are a 0.1μF supply bypass capacitor and a 50Ω series resistor on the data line. The flex edge is an 8-position 0.5mm pitch connector that mates with a standard connector such as Kyocera 046288008000846+ or Molex 0527450897.