Seeed Studio Jetson AGX Orin 32GB H01 Module Kit

Seeed Studio Jetson AGX Orin 32GB H01 Module Kit is a powerful solution for AI development, featuring the high-performance Jetson AGX Orin™ 32GB Module. The Seeed Studio kit has a comprehensive carrier board with advanced connectivity options. With 200 TOPs of AI processing power and pre-installed JetPack 5.0.2, this kit provides an alternative to the Jetson AGX Orin Dev Kit. The kit comes with a heatsink and cooling fan, an aluminum case, and an array of ports. The ports include PCIe X16, GbE, 10GbE, USB 3.2, HDMI 2.1, M.2 Key M and E, Wi-Fi®, BLUETOOTH®, MIPI CSI-2, and a 40-pin header.

Features

On-device processing with up to 200 TOPS AI performance with low power and low latency
Compact size at 107mm x 106.4mm x 70.5mm
Includes Jetson AGX Orin production module, a heatsink with a cooling fan, enclosure, and a power adapter

PCIe X16, GbE, 10GbE, 3x USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi-Fi, Bluetooth, 16 lane MIPI CSI-2, 40-pin header
Pre-installed JetPack 5.0.2, Linux OS BSP, support Jetson software and leading AI frameworks and software platforms