Murata LBEE5PL2DL Multiprotocol Module

Murata LBEE5PL2DL Multiprotocol Module is a Type 2DL Wi-Fi^® + BLUETOOTH^® module that supports Wi-Fi 6 (IEEE 802.11a/b/g/n/ac/ax) + Bluetooth 5.3 BR/EDR/LE specifications. This small and high-performance LBEE5PL2DL module is based on NXP’s IW611 combo chipset. The LBEE5PL2DL Wi-Fi + Bluetooth module features SISO with 20MHz, 40MHz, and 80MHz channels and supports up to MCS11 601Mbps data rates. This multiprotocol module includes an SDIO 3.0 WLAN interface and an HCI UART Bluetooth interface for better performance. The LBEE5PL2DL module operates at -40°C to 85°C temperature range and 1.71V to 3.46V supply voltage range.

The Murata LBEE5PL2DL Multiprotocol Module features a compact 8.8mm x 7.7mm x 1.3mm package ideal for space-constrained applications.

Features

NXP IW611 inside
Supports IEEE 802.11a/b/g/n/ac/ax specifications
Supports dual band 2.4GHz and 5GHz
SISO with 20MHz, 40MHz, and 80MHz channels
Up to MCS11 601Mbps data rates
Supports Bluetooth specification version 5.3
For supported Bluetooth functions, refer to Bluetooth SIG site
SDIO 3.0 WLAN interface
HCI UART Bluetooth interface

-40°C to 85°C operating temperature range
Dimensions: 8.8mm x 7.7mm x 1.3mm
Weighs about 0.22g
Moisture Sensitivity Level-3 (MSL-3)
Surface-mount type
RoHS compliant

Applications

IoT
Handheld wireless systems

Gateways
Video streaming solutions

Murata LBEE5PL2DL Multiprotocol Module

Features

Applications

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